Where lithographic processes require the alignment of structures on only one side of the device wafer (e.g. RDL, microbumping and similar techniques), top-side alignment is used to align the fiducials on the mask with those of the wafer. Depending on substrate properties, this can be achieved either using stored position data for the wafer or through live image alignment, as in the DirectAligntm system invented at SUSS MicroTec. 

Highlights

Mask aligner for the highest level of alignment precision

Clear and stable pattern recognition even under poor constrast conditions

Available for:

Automated Mask Aligner

· MA300 Gen2

· MA200 Gen3

· MA100/150e Gen2

Semi-Automated Mask Aligner

· MA12

· MA/BA Gen4 Pro series

· MA/BA Gen4 series

· MA/BA6

Manual Mask Aligner

· MJB4